Bhubaneswar to host India’s first advanced 3D glass packaging facility
Odisha has secured India’s first advanced 3D chip packaging facility, an INR 1,943-crore project in Bhubaneswar designed to manufacture high-end glass substrates for global electronics.
20 Apr 2026 | By Jiya Somaiya
The event was attended by several distinguished dignitaries (Photo: PIB Bhubaneswar)
In a move to centralise India’s position in the global semiconductor value chain, the foundation stone for the nation’s first advanced 3D chip packaging facility was laid at Info Valley on 19 April.
The project, led by Heterogeneous Integration Packaging Solutions — a subsidiary of US-based 3D Glass Solutions — represents a total investment of INR 1,943.53-crore and signals Odisha’s transition from a resource-driven economy to a high-tech manufacturing hub.
The ceremony featured Chief Minister Mohan Charan Majhi and Union Minister for Electronics and IT Ashwini Vaishnaw, who highlighted the facility’s role as a vertically integrated advanced packaging and embedded glass substrate unit.
The plant aims to address gaps in domestic electronics by supporting next-generation sectors, including artificial intelligence (AI), 5G/6G telecommunications, and defence electronics.
The project is backed by various government incentives, including INR 799-crore in federal fiscal support and approximately INR 399.5-crore from the state government.
Once operational, the plant is projected to produce 70,000 glass panels annually alongside 50-million assembled units and 13,000 advanced 3D heterogeneous integration modules.
Commercial production is scheduled to begin in August 2028, with the facility reaching full-scale volume production by August 2030.
Chief Minister Majhi noted that Odisha is currently the only Indian state to host both a compound semiconductor fabrication unit and a 3D glass substrate packaging plant. This ecosystem is expected to generate employment for engineering and technical graduates, moving the state toward technology-led growth.
Union Minister Vaishnaw further emphasised that India’s electronics manufacturing has grown six-fold over the last 12 years, with the country now serving as the world’s second-largest mobile phone manufacturer. He confirmed that while two semiconductor projects are approved for Odisha, three additional proposals are currently under review.