Interpack will host young talents day to bridge industry skills gap
Interpack 2026 will host a dedicated young talents day on 13 May to provide trainees, students, and young professionals with direct entry routes into the packaging and processing industry.
28 Apr 2026 | By Anand Singh
The event, to held at Dusseldorf, will offer a central platform for career orientation across diverse sectors including food technology, engineering, and sustainable management. According to the organisers, the programme will focus on "future skills" ranging from technical digitisation to sustainable circular thinking.
A key feature of the day will be the young talents tour, where participants will receive practical introductions from young industry representatives. The tour will include site visits to major exhibitors such as Koch Pac-systeme, Fawema, Loeschpack, Theegarten-pactec, and Gerhard Schubert to demonstrate current technologies and job profiles along the value chain. For school pupils interested in apprenticeships, a specialised career tour will match participants with potential employers directly on the show floor.
The Spotlight Forum will complement these tours with sessions like Nextgen Plastics, while a science slam will allow young researchers to present packaging projects in an interactive format. In Hall 4, the VDMA Technology Lounge will showcase the Cirmqind project, an interactive exhibit where young visitors will experience the circular economy through waste sorting, recycling demonstrations, and AI-driven processes.
Participation in young talents day is free for students and trainees with a valid ID, though organisers require binding registration for specific tours due to limited capacity. The initiative aims to uncover how job profiles are evolving in response to global sustainability and digitalisation trends.
