29 May 2025 | By WhatPackaging? Team
The MoU outlines a roadmap for integrating Autodesk’s advanced design and make platforms into academic curricula.
13 Jan 2026
17 Jan 2026
15 Jan 2026
What is the biggest issue in the process of recycling?
No structured collection infrastructure
57.14%
Identification of polymer types
14.29%
Sorting of flexibles due to diverse film structures
9.52%
Lack of automation in waste collection
19.05%
Dec 19, 2025
Dec 15, 2025
Dec 08, 2025
Dec 03, 2025
Jan 20 - Jan 22 2025 Fespa Middle East 2025 is a key reg....
