IIP Delhi set to host ISPI 5S-Ai 2026 in March

The Indian Institute of Packaging (IIP) Delhi is set to host the International Summit for the Packaging Industry (ISPI) FS-Ai 2026 from 12-14 March 2026 at Eros Hotel, Nehru Place, in New Delhi.

The summit is designed to synchronise global manufacturing capabilities with the evolving demands of the modern consumer. The primary objective of the event is to showcase the integration of automation and high-speed conversion technologies to increase industrial productivity while reducing material wastage. 

5S framework
Assembling a diverse panel of experts, the summit is set to serve as a forum for discussing the safety, security, standardisation, smart technology, and sustainability (5S) framework that is currently redefining global trade requirements.

A central highlight of the summit is the focus on safe and secure packaging, where presenters will examine global compliance standards and the implementation of intelligent management systems to ensure product integrity during shipping. 

Furthermore, the event will address the need for standardisation, exploring how uniform packaging metrics can optimise costs and reduce carbon footprints across the supply chain. The technical sessions on smart packaging and artificial intelligence will delve into the transformative potential of predictive quality detection, defect monitoring, and the use of robotics to streamline end-of-line automation.

Research conclave and IIP Packathon
Additionally, to foster the next generation of industry leaders, IIP will host a parallel research conclave, inviting students and scientists from global universities to present peer-reviewed papers on innovative material systems, motivating young researchers to enhance the academic credibility of packaging science. 

Complementing this is the IIP Packathon, a segment for industry startups. This platform will feature various innovations, such as edible, nutrient-dense packaging materials for instant foods and one-of-a-kind bio-based solutions capable of organic decomposition within 180 days. 

Collectively, these segments position the summit as a vital nexus for commercial application and future-forward research.